COIN417/R Infrared Camera Core
Longwave FPA 400x300 / 17μm VOx Uncooled Thermal Camera Core
Product Description
COIN417/R uncooled infrared modules integrates 400x300 / 17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm. Thanks to the wafer level packaging technology, the WLP infrared detector has simpler manufacturing process and easier to be integrated, which is more suitable for high volume and low cost production.
The COIN417/R infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series infrared modules to be integrated into more terminal products and greatly reduces the cost for customers.
Main Features
- Mini Size: 25.4x25.4x14.1mm
- Light Weight
- NETD<40mk
- High Quality Image
- Low Power Consumption
- Rapid Development & Integration
Product Specifications
| Model | COIN417/R |
| IR Detector Performance |
| Resolution | 400x300 |
| Pixel Pitch | 17μm |
| Spectral Range | 8~14μm |
| NETD | <40mk |
| Image Processing |
| Frame Rate | 25Hz/30Hz/50Hz/60Hz |
| Start-up Time | ≤10s |
| Analog Video | PAL/NTSC |
| Digital Video | RAW/YUV/BT656 |
| Dimming Mode | Linear/Histogram/Mixed |
| Digital Zoom | 1~8X Continual Zoom, Step Size 1/8 |
| Image Display | Black Hot/White Hot/Pseudo Color |
| Image Direction | Horizontally/Vertically/Diagonally Flip |
| Image Algorithm | NUC/AGC/IDE/DNR |
| Electrical Specification |
| Standard External Interface | 30pin_HRS |
| Communication Mode | RS232-TTL, 115200bps |
| Supply Voltage | 3.5~5.5V |
| Typical Power Consumption | <1.1W |
| Temperature Measurement |
| Operating Temperature Range | -10°C~50°C |
| Temperature Measurement Range | -20°C~150°C, 100°C~550°C |
| Temperature Accuracy | ±3℃ or ±3% (Take the Maximum Value) |
| SDK | Support ARM/Windows/Linux SDK, Full Screen Thermography |
| Physical Characteristics |
| Dimension (mm) | 25.4x25.4x14.1 (With Shutter) |
| Weight | 13g±0.5g (Without Lens) |
| Environmental Adaptation |
| Operation Temperature | -40°C ~ +70°C |
| Storage Temperature | -45°C ~ +85°C |
| Humidity | 5%~95%, Non-condensing |
| Vibration | Random Vibration 5.35grms, 3 Axis |
| Shock | Half-sine Wave, 40g/11ms, 3 Axis 6 Direction |
| Optics |
| Optional Lens | Fixed Focus Athermal: 9.7mm/15mm/19mm |
Industrial Applications
The COIN417/R infrared camera core is widely used in Thermography, Security & Monitoring, Outdoors, Firefighting & Rescue, AIoT, Intelligent Hardware, UAV Payloads, ADAS etc.
Our Advantages
FAQs
1. What is infrared thermography?
Thermography is a new and effective technology of non-invasive diagnostic method based on object surface temperature detection. The infrared (IR) radiation emitted from an object is recorded and visualized in the form of a temperature distribution map.
2. What can the infrared thermography be used for?
The infrared thermal image can be used to perform home inspections, determine structural defects, electrical faults, mechanical faults, physiological changes in people & animals and much more.
3. What are the advantages of infrared thermography?
For the non-destructive test, it is simple to test and quick to response without damage, which results in saving costs, increasing work efficiency, reducing manpower and equipment depreciation.
For the medical thermography, it is very efficient to find the hidden problems in human body, 100% safe without radiation and pain, which is an ideal tool for early health screening.
Product Tags:
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Uncooled Thermal Camera Core Longwave FPA 400x300 / 17μm VOx Images
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